Aspact® is an additive pattern plating technology that can be used for several purposes. The patterns are deposited in a galvanic process on a temporary substrate that can be, for example, a copper foil or a stainless steel substrate. The choice depends on the application and required patterning resolution.
The patterns are transferred on an IML foil (In Mould Labelling) for injection moulding to integrate conductors in 3D polymer parts.
Another way of producing 2.5D and 3D parts is to transfer the conductor pattern on a thermoplastic substrate, either directly to the final form or the part can be formed after the pattern transfer.
The third main application is very fine line interconnect substrates with down to a few micron lines and spaces.